US Patent Issued to KIOXIA on July 21 for "Substrate processing apparatus and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,408, issued on July 21, was assigned to KIOXIA Corp. (Tokyo).

"Substrate processing apparatus and method for manufacturing semiconductor device" was invented by Yosuke Maruyama (Yokkaichi Mie, Japan), Takahiro Kawata (Yokkaichi Mie, Japan) and Satoshi Nakaoka (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a processing tank configured to store a solution capable of processing a substrate; a supply configured to supply the solution to the processing tank; a holding member having an openable and closable support portion capable of sandwiching the substrate, the holding member configured t...