US Patent Issued to Kioxia on Aug. 4 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,810, issued on Aug. 4, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Akira Nakajima (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor device according to an embodiment, a first connection wiring layer and a second connection wiring layer are bonded such that a first surface and a second surface face each other and a first electrode and a second electrode are in contact with each other, wherein the first electrode includes a first barrier metal film provided in a first trench and containing Ti, and a first conductive film provided in t...