ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,885, issued on Aug. 18, was assigned to KIOXIA Corp. (Tokyo).
"Semiconductor device manufacturing method" was invented by Kazuhiro Takahata (Yokohama Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing method includes forming, on a substrate, a stacked body including a plurality of first films and a plurality of second films alternately stacked in a height direction; and forming a number (mxn) of holes through the stacked body that haves a number (mxn) of depths. The number (m) depths are arranged in a first direction intersecting the height direction and the number (n) depths are arranged in a second ...