US Patent Issued to Kioxia on Aug. 18 for "Multi-chip package and memory system" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. RE51,005, issued on Aug. 18, was assigned to Kioxia Corp. (Tokyo).

"Multi-chip package and memory system" was invented by Naoki Matsunaga (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-chip package includes a first group of memory chips that includes a first memory chip and a second memory chip, a second group of memory chips that includes at least one memory chip, a first internal wiring system that couples the first memory chip and the second memory chip to a first terminal configured to receive a chip-enable signal, a second internal wiring system that couples the at least one memory chip to a second terminal configured to receive the chi...