US Patent Issued to KIOXIA on April 21 for "Wafer transfer carrier and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,778, issued on April 21, was assigned to KIOXIA Corp. (Tokyo).

"Wafer transfer carrier and semiconductor device manufacturing method" was invented by Satoshi Nakaoka (Yokkaichi Mie, Japan) and Hiroyasu Iimori (Nagoya Aichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer transfer carrier includes a container and a lid portion. The container accommodates a wafer and a liquid, and is movable in a state where the wafer is in contact with the liquid. The lid portion is capable of sealing an inside of the container."

The patent was filed on Aug. 29, 2023, under Application No. 18/457,821.

*For further information, including images, charts...