US Patent Issued to KIOXIA on April 21 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,856, issued on April 21, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Soichi Homma (Mie, Japan) and Kazuma Hasegawa (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: an interconnect substrate including a plurality of interconnect layers; a first semiconductor chip disposed over the interconnect substrate; a second semiconductor chip disposed over the first semiconductor chip in a shifted manner and including a plurality of metal bumps on a surface of the second semiconductor chip facing the interconnect substrate; and a p...