ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,391, issued on Oct. 6, was assigned to KCTECH Co. LTD. (Gyeonggi-do, South Korea).

"Substrate polishing apparatus" was invented by Sung Ho Shin (Gyeonggi-do, South Korea), Hee Cheul Jung (Seoul, South Korea) and Soo Ho Kim (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to control a temperature of the polishing pad, and the temperature c...