ALEXANDRIA, Va., July 28 -- United States Patent no. 12,691,662, issued on July 28, was assigned to KAO Corp. (Tokyo).
"Packaging body and method for producing same" was invented by Masaki Hiwatashi (Utsunomiya, Japan) and Hotaka Takakuwa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package (1) includes a bag (20) and a sheet laminate (10) packaged in the bag (20). The sheet laminate (10) includes a first fiber sheet (11) including a first fiber including a PET resin having a melting point higher than 230deg C., and a second sheet (12) including a thermoplastic resin having a melting point of 230deg C. or lower. The sheet laminate (10) includes a joined portion (30) in which the first fiber sheet ...