ALEXANDRIA, Va., April 7 -- United States Patent no. 12,594,598, issued on April 7, was assigned to KAO Corp. (Tokyo).
"Copper fine particle dispersion" was invented by Takaaki Eyama (Wakayama, Japan), Osamu Takiguchi (Wakayama, Japan) and Tomohide Yoshida (Wakayama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A copper fine particle dispersion including copper nanoparticles A dispersed in the copper fine particle dispersion with a polymer B, and a dispersion medium C. The polymer B contains a constitutional unit derived from a carboxy group-containing monomer (b-1) and a polyalkylene glycol segment-containing monomer (b-2). A content of the polyalkylene glycol segment in the polymer B is not less th...