US Patent Issued to KANEKA on Nov. 3 for "Curable composition and use of same" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,781,112, issued on Nov. 3, was assigned to KANEKA Corp. (Osaka, Japan).

"Curable composition and use of same" was invented by Akira Ogawa (Hyogo, Japan), Masaomi Sakabe (Hyogo, Japan) and Ayako Yano (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The object is to provide, without use of an epoxy resin, a curable composition which has good workability and which has excellent adhesiveness even after an alkaline treatment. The object is attained by providing a curable composition containing: (A) 100 parts by weight of an organic polymer having a hydrolyzable silyl group; (B) 3 parts by weight to 35 parts by weight of at least one type of proces...