US Patent Issued to KANEKA on Aug. 11 for "Optical semiconductor device, method for manufacturing same, solid-state imaging device, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,884, issued on Aug. 11, was assigned to KANEKA Corp. (Osaka, Japan).

"Optical semiconductor device, method for manufacturing same, solid-state imaging device, and electronic device" was invented by Daiki Kinoshita (Settsu, Japan), Yuta Saito (Settsu, Japan) and Kenta Kuroda (Settsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical semiconductor device includes a semiconductor substrate provided with a light receiving element; a transparent substrate facing a surface of the semiconductor substrate on which the light receiving element is provided; and an adhesive layer that bonds the semiconductor substrate and the transparent substrate...