US Patent Issued to KANEKA on April 7 for "Thermoplastic resin composition and method for producing same" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,363, issued on April 7, was assigned to KANEKA Corp. (Osaka, Japan).

"Thermoplastic resin composition and method for producing same" was invented by Yuichi Imamura (Osaka, Japan), Masayoshi Kido (Osaka, Japan) and Takahiro Akinaga (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provi...