ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,033, issued on March 3, was assigned to JWS TECHNOLOGY Co. LTD. (New Taipei City, Taiwan).
"Three-dimensional vapor chamber device" was invented by Cheng-Tu Wang (New Taipei, Taiwan), Pang-Hung Liao (New Taipei, Taiwan) and Chih-Wei Chen (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure is directed to a three-dimensional vapor chamber device having a thermal base, a vertical thermal plate arranged up-right on the thermal base, and a working fluid accommodated in the thermal base and may flow to the vertical thermal plate. A first chamber having a first capillary structure is defined in the thermal base. A second cham...