US Patent Issued to JTEKT on March 31 for "Injection molding device" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,539, issued on March 31, was assigned to JTEKT Corp. (Kariya, Japan).

"Injection molding device" was invented by Yusuke Okubo (Aichi, Japan), Toshiyuki Baba (Nara, Japan), Kouji Kimura (Nara, Japan), Tomoya Adachi (Osaka, Japan), Hiroshi Kutsumi (Hyogo, Japan), Yoshiki Kojima (Nara, Japan), Satoshi Haraguchi (Kyoto, Japan), Sachiko Tachibana (Aichi, Japan), Shota Mizoguchi (Aichi, Japan) and Toshihiro Moriuchi (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An injection molding device includes an injection device including a cylinder, a screw, and a nozzle provided at a front end of the cylinder, for discharging molten resin as the scr...