US Patent Issued to JSW AKTINA SYSTEM on Feb. 17 for "Laser processing apparatus, laser processing method, and method for manufacturing semiconductor apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,551,971, issued on Feb. 17, was assigned to JSW AKTINA SYSTEM Co. LTD (Yokohama, Japan).

"Laser processing apparatus, laser processing method, and method for manufacturing semiconductor apparatus" was invented by Naoyuki Kobayashi (Yokohama, Japan), Masashi Machida (Yokohama, Japan) and Hiroaki Imamura (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser processing apparatus and a laser processing method that can effectively prevent a processing time for one semiconductor film from increasing are provided. A laser processing apparatus (1) according to an embodiment includes a laser light source (2) configured to irradiate a semiconduc...