US Patent Issued to JSR on Feb. 24 for "Radiation-sensitive resin composition, method of forming resist pattern, polymer, and compound" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,866, issued on Feb. 24, was assigned to JSR Corp. (Tokyo).

"Radiation-sensitive resin composition, method of forming resist pattern, polymer, and compound" was invented by Ryuichi Nemoto (Tokyo), Ryotaro Tanaka (Tokyo), Taiichi Furukawa (Tokyo), Katsuaki Nishikori (Tokyo) and Hiromitsu Nakashima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radiation-sensitive resin composition includes: a first polymer including a structural unit including an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), A represents an oxygen atom or a sulfur atom;...