US Patent Issued to JSP on March 31 for "Hipe foam and method for producing same" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,176, issued on March 31, was assigned to JSP Corp. (Chiyoda-ku, Japan).

"Hipe foam and method for producing same" was invented by Yohei Kaneko (Mie, Japan) and Kenji Haraguchi (Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A HIPE foam may including a vinyl-based crosslinked polymer as a base material resin. The vinyl-based crosslinked polymer may be formed by crosslinking a polymer of a styrene-based monomer and/or an acryl-based monomer. An apparent density Rho of the HIPE foam may be 35 kg/m3 or more and 500 kg/m3 or less. A molecular weight between crosslinking points of the vinyl-based crosslinked polymer forming the HIPE foam may b...