US Patent Issued to JF MICROTECHNOLOGY SDN. BHD. on July 14 for "Spring contact in a testing apparatus for integrated circuits" (Malaysian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,044, issued on July 14, was assigned to JF MICROTECHNOLOGY SDN. BHD. (Petaling Jaya, Malaysia).

"Spring contact in a testing apparatus for integrated circuits" was invented by Wei Kuong Foong (Petaling Jaya, Malaysia), Kok Sing Goh (Petaling Jaya, Malaysia), Shamal Mundiyath (Petaling Jaya, Malaysia), Eng Kiat Lee (Petaling Jaya, Malaysia) and Grace Ann Nee Yee (Petaling Jaya, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vertical spring contact that is constructed of a single piece of electrical conductor, having a central compressible spine that acts as a spring. This contact is also provided with a pair of arms extending downwards fro...