US Patent Issued to JEONGYANG SG on June 30 for "Heat insulation UHPC composition having enhanced heat insulation properties and compressive strength" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,541, issued on June 30, was assigned to JEONGYANG SG Co. LTD. (Chungcheongnam-do, South Korea).

"Heat insulation UHPC composition having enhanced heat insulation properties and compressive strength" was invented by Byung Kwun Ahn (Daejeon, South Korea), Young Jong Yoo (Gyeonggi-do, South Korea), Sang Hee An (Daejeon, South Korea), Chang Keun Song (Chungcheongnam-do, South Korea), Jun Bum Ahn (Chungcheongnam-do, South Korea) and Jae Wook Baek (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat insulation UHPC composition having enhanced heat insulation properties and compressive strength is provided where silica beads are mixe...