US Patent Issued to JCET STATS ChipPAC Korea on June 16 for "Semiconductor device and method of forming an antenna-in-package structure" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,673, issued on June 16, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea).

"Semiconductor device and method of forming an antenna-in-package structure" was invented by Yejin Park (Incheon, South Korea), Seunghyun Lee (Incheon, South Korea) and Heesoo Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate including an antenna formed in a first area of the substrate. An electrical component is disposed over a second area of the substrate. An interconnect structure is disposed over a third area of the substrate. A first encapsulant is deposited over the electrical component and intercon...