US Patent Issued to JCET STATS ChipPAC Korea on April 14 for "Semiconductor device and method of forming a 3-D stacked semiconductor package structure" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,739, issued on April 14, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea).

"Semiconductor device and method of forming a 3-D stacked semiconductor package structure" was invented by SeungHyun Lee (Incheon, South Korea), YeJin Park (Incheon, South Korea) and HeeSoo Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a first electrical component disposed over the substrate. An encapsulant is deposited over the first electrical component. A shielding layer is formed over the encapsulant. The shielding layer is patterned to form a conductive trace and a contact pad. A board-to-b...