US Patent Issued to JCET GROUP on March 31 for "Packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,731, issued on March 31, was assigned to JCET GROUP Co. LTD. (Wuxi City, China).

"Packaging structure and manufacturing method thereof" was invented by Yaojian Lin (Wuxi City, China), Chen Xu (Wuxi City, China), Shuo Liu (Wuxi City, China), Danfeng Yang (Wuxi City, China), Shasha Zhou (Wuxi City, China), Xueqing Chen (Wuxi City, China) and Chenye He (Wuxi City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes: a lower package, an upper package disposed above the lower package, and a first redistribution stack layer that is d...