US Patent Issued to JCET GROUP on March 17 for "Packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,965, issued on March 17, was assigned to JCET GROUP Co. LTD. (Wuxi City, China).

"Packaging structure and manufacturing method thereof" was invented by Yaojian Lin (Wuxi City, China), Danfeng Yang (Wuxi City, China), Chen Xu (Wuxi City, China), Shuo Liu (Wuxi City, China), Chenye He (Wuxi City, China), Shasha Zhou (Wuxi City, China) and Xueqing Chen (Wuxi City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes a lower package, an upper package and a first redistribution stack layer disposed between the lower package and the u...