US Patent Issued to ISHIDA on May 5 for "Flap folding device, box manufacturing device, box sealing device, and box packaging device" (Japanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,617,570, issued on May 5, was assigned to ISHIDA Co. LTD. (Kyoto, Japan).

"Flap folding device, box manufacturing device, box sealing device, and box packaging device" was invented by Tatsuya Iwasa (Ritto, Japan) and Yuji Yokota (Ritto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flap folding device includes a first member that folds a pair of first flaps toward an inside of an opening of a cardboard box, a second member that folds a pair of second flaps toward the inside of the opening, and a holding member including a rod-shaped or plate-shaped elongated portion extending along a long side direction of the opening, and pressing and holding th...