ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,428, issued on July 28, was assigned to Inventec (Pudong) Technology Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan).
"Liquid cooling device and server" was invented by Jiaqing Ji (Shanghai), Jingnan Zhao (Shanghai) and Boheng Zeng (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plat...