ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,695, issued on Feb. 24, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei, Taiwan).
"Electronic device and heat dissipation method therefor" was invented by Guo-Ping Wu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a heat dissipation method for an electronic device. The electronic device includes a first fan and a power supply unit. The first fan generates airflow through the device. The power supply unit includes a second fan which generates airflow through the power supply unit. A speed of the first fan is controlled by a first current control data. A speed of the second fan is control...