US Patent Issued to International Business Machines on Oct. 6 for "Asymmetric skip-level via structure" (New York Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,702, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Asymmetric skip-level via structure" was invented by Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Reinaldo Vega (Mahopac, N.Y.), Takashi Ando (Eastchester, N.Y.) and David Wolpert (Poughkeepsie, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes a skip via. The skip via includes a first skip via segment vertically connected to a second skip via segment. The first skip via segment has a first width and the second skip via segment has a second wid...