US Patent Issued to International Business Machines on Nov. 3 for "Dual-side bridge chips connecting two semiconductor chips with stacked semiconductor devices" (New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,880, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Dual-side bridge chips connecting two semiconductor chips with stacked semiconductor devices" was invented by Manasa Medikonda (Albany, N.Y.), Tao Li (Slingerlands, N.Y.), Ruilong Xie (Niskayuna, N.Y.) and Joshua M. Rubin (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes at least two chiplets, where each chiplet includes a top semiconductor device with frontside interconnect wiring contacting a substrate with through-silicon vias and the top semiconductor device contacts a bottom semiconductor device with backsid...