US Patent Issued to International Business Machines on May 19 for "Interconnect structure with increased decoupling capacitance" (New York, New Hampshire Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,513, issued on May 19, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Interconnect structure with increased decoupling capacitance" was invented by Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Albert M. Chu (Nashua, N.H.) and Lawrence A. Clevenger (Saratoga Springs, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip device includes a substrate with a first dielectric material of a first permittivity value. A power input line and ground line are positioned in the substrate and arranged to form a decoupling capacitor. A region of the substrate in between the power input line and the ground line is doped w...