ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,045, issued on May 12, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Cell-based signal connectivity between wafer frontside and backside" was invented by David Wolpert (Poughkeepsie, N.Y.), Leon Sigal (Monsey, N.Y.), Ruilong Xie (Niskayuna, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Biswanath Senapati (Mechanicville, N.Y.) and Lawrence A. Clevenger (Saratoga Springs, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first backside metal rail that extends across the structure and a second backside metal rail parallel and adjacent to the first backside metal rail. The first and ...