US Patent Issued to International Business Machines on March 3 for "Conformal dielectric cap for subtractive vias" (New York Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,806, issued on March 3, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Conformal dielectric cap for subtractive vias" was invented by Sagarika Mukesh (Albany, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Robert Robison (Rexford, N.Y.), Ruqiang Bao (Niskayuna, N.Y.) and Ardasheir Rahman (Schenectady, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provide a semiconductor structure including a first metal contact, where at least a portion of the first metal contact extends vertically from a substrate to a top portion of the semiconductor structure. The first metal contact havin...