ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,309, issued on June 30, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Semiconductor structures with wrap-around contact structure" was invented by Ruilong Xie (Niskayuna, N.Y.), Jingyun Zhang (Albany, N.Y.), Reinaldo Vega (Mahopac, N.Y.) and Alexander Reznicek (Troy, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a source/drain region having a recessed portion. The semiconductor structure further includes a metal contact having a first portion and a second portion. The first portion of the metal contact has a first width and the second portion of the metal contact has a second width gr...