US Patent Issued to International Business Machines on June 23 for "Clustering fine pitch micro-bumps for packaging and test" (American, German Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,012, issued on June 23, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Clustering fine pitch micro-bumps for packaging and test" was invented by David Michael Audette (Colchester, Vt.), Grant Wagner (Jericho, Vt.), Steven Paul Ostrander (Poughkeepsie, N.Y.), Hubert Harrer (Schoenaich, Germany), Arvind Kumar (Chappaqua, N.Y.), Thomas Anthony Wassick (LaGrangeville, N.Y.), Matthew Sean Grady (Burlington, Vt.) and Sungjun Chun (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a chip package that has a chip connection surface and has an array of micro-bumps on the chip connection surface. The arr...