ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,739, issued on July 28, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Handler wafer with low overlay residual backside patterning" was invented by Prabudhya Roy Chowdhury (Albany, N.Y.), Daniel Charles Edelstein (White Plains, N.Y.) and Shay Reboh (Guilderland, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a device wafer, including a silicon wafer. A handler wafer is bonded to the device wafer. The handler wafer includes a 111 crystallographic direction silicon substrate."
The patent was filed on Sept. 13, 2023, under Application No. 18/466,783.
*For further information, including imag...