US Patent Issued to International Business Machines on July 14 for "Advanced pitch interconnects with multiple low aspect ratio segments" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,102, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Advanced pitch interconnects with multiple low aspect ratio segments" was invented by Oscar van der Straten (Guilderland Center, N.Y.), Koichi Motoyama (Clifton Park, N.Y.), Willie Lester Muchrison Jr. (Troy, N.Y.) and Chih-Chao Yang (Glenmont, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes a first high aspect ratio metal line. The first high aspect ratio metal line includes a first low aspect ratio line segment and a second low aspect ratio...