US Patent Issued to International Business Machines on Feb. 17 for "Dual-phase evaporative cooling in sealed electronics devices" (New York Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,245, issued on Feb. 17, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Dual-phase evaporative cooling in sealed electronics devices" was invented by Sadegh Khalili (Poughkeepsie, N.Y.), Yuanchen Hu (Peekskill, N.Y.), Milnes P. David (New Paltz, N.Y.) and Levi Campbell (Poughkeepsie, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sealed dual-phase evaporative cooling enclosure is disclosed. The sealed dual-phase evaporative cooling enclosure comprises one or more high-heat dissipating components, one or more low-heat dissipating components, a wicking structure; and a condenser, where the wicking structure is proximal to...