US Patent Issued to International Business Machines on Aug. 4 for "Thermal expansion matched chip module with integrated liquid cooling" (New Jersey, New York Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,004, issued on Aug. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Thermal expansion matched chip module with integrated liquid cooling" was invented by Evan Colgan (Montvale, N.J.), Jae-Woong Nah (Closter, N.J.), Katsuyuki Sakuma (Fishkill, N.Y.), Kamal K. Sikka (Poughkeepsie, N.Y.), Joshua M. Rubin (Albany, N.Y.) and Frank Robert Libsch (White Plains, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip and cooler assembly includes an active or passive interposer that has a front side and a back side. Integrated circuit chips are mounted onto the back side of the interposer. Each of the chips has a front side that i...