US Patent Issued to International Business Machines on Aug. 4 for "Self-aligned via in double diffusion break to connect to backside interconnects" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,984, issued on Aug. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Self-aligned via in double diffusion break to connect to backside interconnects" was invented by Reinaldo Vega (Mahopac, N.Y.), Ruilong Xie (Niskayuna, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Albert M. Chu (Nashua, N.H.), Lawrence A. Clevenger (Saratoga Springs, N.Y.) and Brent A. Anderson (Jericho, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic structure including a plurality of nanosheet transistors. Each of the plurality of nanosheet transistors includes an active gate located around a plurality of active channel layers...