ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,153, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Topological semi-metal interconnects" was invented by Ching-Tzu Chen (Ossining, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Vijay Narayanan (New York) and Takeshi Nogami (Schenectady, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for fabricating an interconnect. The method comprises forming a topological semi-metal layer. The method further comprises patterning the topological semi-metal layer to form one or more interconnects. The method further comprises forming a dielectric layer between the one or more interconnects...