US Patent Issued to International Business Machines on April 7 for "Front end of line processing compatible thermally stable buried power rails" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,980, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Front end of line processing compatible thermally stable buried power rails" was invented by Sagarika Mukesh (Albany, N.Y.), Christian Lavoie (Pleasantville, N.Y.), Daniel Charles Edelstein (White Plains, N.Y.) and Ruilong Xie (Niskayuna, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices, and methods of their formation, are provided. The semiconductor device can include a substrate; a wiring level within the substrate; and at least one buried power rail within the wiring level, wherein the at least one buried power rail is divided i...