ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,330, issued on July 7, was assigned to INTERESTELAR X SPA (Santiago, Chile).
"High-strength modular floor" was invented by Francisco Cruz Quiroga (Santiago, Chile).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high-strength modular floor is presented, formed by two or more floor modules securely coupled together. The modular floor includes curved connectors for securing coupled floor modules together. The high-strength modular floor is versatile, can be adapted for different industrial and commercial uses, and is formed by high-strength floor modules securely coupled together by one or more curved connectors, which restrict relative movement betwee...