US Patent Issued to Intel on Sept. 8 for "Socket interconnect structures and related methods" (American, Mexican Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,947, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Socket interconnect structures and related methods" was invented by Kai Xiao (Portland, Ore.), Phil Geng (Washougal, Wash.), Carlos Alberto Lizalde Moreno (Guadalajara, Mexico), Raul Enriquez Shibayama (Zapopan, Mexico) and Steven A. Klein (Chanlder, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground str...