US Patent Issued to Intel on Sept. 8 for "PCB fabrication with EMI film on multi-layer rigid PCB" (Indian Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,089, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"PCB fabrication with EMI film on multi-layer rigid PCB" was invented by Arumanayagam Rajasekar (Nagercoil, India), Hariharan Kaliyavarathan (Villupuram, India), Srinivas Reddy B.M. (Bangalore, India), Yagnesh Vinodrai Waghela (Bengaluru, India) and Piyush Bhatt (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a core and routing layers over and under the core. In an embodiment, a multi-layer shield is over at least one of the routing layers. In an embodiment...