US Patent Issued to Intel on Sept. 8 for "Packaging architecture with patterned through-dielectric vias and redistribution layers" (Arizona, Texas, Oregon Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,517, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Packaging architecture with patterned through-dielectric vias and redistribution layers" was invented by Adel A. Elsherbini (Tempe, Ariz.), Christopher M. Pelto (Beaverton, Ore.), Kimin Jun (Portland, Ore.), Brandon M. Rawlings (Chandler, Ariz.), Shawna M. Liff (Scottsdale, Ariz.), Bradley A. Jackson (Lake Oswego, Ore.), Robert J. Munoz (Round Rock, Texas) and Johanna M. Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurali...