US Patent Issued to Intel on Sept. 8 for "Microelectronic assemblies having integrated thin film capacitors" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,499, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies having integrated thin film capacitors" was invented by Kristof Kuwawi Darmawikarta (Chandler, Ariz.), Benjamin T. Duong (Phoenix), Srinivas V. Pietambaram (Chandler, Ariz.), Thomas Sounart (Chandler, Ariz.), Aleksandar Aleksov (Chandler, Ariz.) and Adel A. Elsherbini (Tempe, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die in a first dielectric layer; and a capacitor including a first conductive pilla...