US Patent Issued to Intel on Sept. 8 for "Damascene interconnect structures with low resistance vias for integrated circuits" (Oregon Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,477, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Damascene interconnect structures with low resistance vias for integrated circuits" was invented by Urusa Alaan (Hillsboro, Ore.), Kevin L. Lin (Beaverton, Ore.), Miriam Reshotko (Portland, Ore.), Sarah Atanasov (Beaverton, Ore.), Christopher Jezewski (Portland, Ore.), Carl Naylor (Portland, Ore.), Mauro Kobrinsky (Portland, Ore.) and Hui Jae Yoo (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit interconnect structures including a metallization line with a bottom barrier material, and a metallization via lacking a bottom barrier material. Bar...