US Patent Issued to Intel on Sept. 8 for "Build up material architecture for microelectronic package device" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,525, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Build up material architecture for microelectronic package device" was invented by Jieying Kong (Chandler, Ariz.), Peumie Abeyratne Kuragama (Chandler, Ariz.), Ala Omer (Phoenix), Ao Wang (Chandler, Ariz.) and Dilan Seneviratne (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic integrated circuit package structures include a first layer over a substrate, the first layer having a matrix material and a filler material within the matrix material. A second layer is on the first layer, the second layer comprising the matrix material or a second material, wher...