US Patent Issued to Intel on Sept. 29 for "Integrated circuit packages with silver and silicon nitride multi-layer" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,309, issued on Sept. 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit packages with silver and silicon nitride multi-layer" was invented by Cemil S. Geyik (Gilbert, Ariz.), Kristof Kuwawi Darmawikarta (Chandler, Ariz.), Zhiguo Qian (Chandler, Ariz.), Kemal Aygun (Tempe, Ariz.), Jung Kyu Han (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Rengarajan Shanmugam (Chandler, Ariz.) and Robert L. Sankman (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are silver-coated conductive structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in s...