ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,749,660, issued on Sept. 29, was assigned to Intel Corp. (Santa Clara, Calif.).
"Enhanced dry desmear equipment with protective film peeling capability for integrated circuits" was invented by Ala Omer (Phoenix), Peumie Abeyratne Kuragama (Chandler, Ariz.), Jieying Kong (Chandler, Ariz.), Wendy Lin (Chandler, Ariz.) and Ao Wang (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure describes designs and methods for via cleaning, peeling protective film, and providing mild surface roughening and cleaning of a computer chip. A system may include a first electrode configured to generate plasma associated with cleaning vias by etch...