US Patent Issued to Intel on Sept. 22 for "Singulation of integrated circuit package substrates with glass cores" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,663, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.).

"Singulation of integrated circuit package substrates with glass cores" was invented by Whitney Bryks (Tempe, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Gang Duan (Chandler, Ariz.), Benjamin Duong (Phoenix) and Srinivas Pietambaram (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, and a sidewall between the first surface and the second surface. A build-up layer is on at least the first surfa...